FP15R12W1T4,INFINEON,IGBT Module

Product Recommendation Maker Dynamics Applications

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  FP25R12W2T4

  IGBT Module ,25A , ,1200V ,56.7*48*15.5mm

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  FS35R12W1T4

  IGBT Module ,35A0 , ,1200V ,48*33.8*15.5mm

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  FF100R12RT4

  IGBT Module ,100A , ,1200V ,94*34*30.5mm

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  LEGM25BE120E2HZ

  IGBT Module ,25A , ,1200V ,56.7*48*15.5mm

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  LEGM100BH120L1H

  IGBT Module ,100A , ,1200V ,94*34*30.5mm

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  LEGM15BE120E1HZ

  IGBT Module ,15A , ,1200V ,48*33.8*15.5mm

  $0.000000 More

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  LEGM35TD120E1HZ

  IGBT Module ,35A0 , ,1200V ,48*33.8*15.5mm

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Product Recommendation Maker Dynamics Applications

• What are the design issues of inverters during the transition from silicon to silicon carbide (SiC)? The design of silicon carbide device inverters is a complex process that requires consideration of many factors to ensure their reliability and performance. Therefore, designers need to fully understand the characteristics of silicon carbide devices and make corresponding adjustments during design to ensure that the inverter can meet the requirements of the application environment

• Why does high negative pressure in SiC MOS affect threshold drift The threshold drift of SiC MOSFET is affected by negative pressure because this device has a high leakage current, which reduces the difference between the control terminal voltage and the source terminal voltage, thereby affecting the switching performance of MOSFET. In addition, high negative pressure may also cause MOSFETs to enter rupture mode and trigger other adverse effects.

• Circuit symbols for silicon carbide (SIC) MOSFETs The circuit symbol of silicon carbide (SiC) MOSFET is similar to that of traditional silicon MOSFET, except that some special markings are added to the symbol to indicate its characteristics.

• Can digital signals pass through isolation chips Can digital signals pass through isolation chips? The answer is yes. Digital signals can be transmitted through isolation chips. Isolation chips are mainly used to isolate signals for the purpose of electrical isolation, ground isolation, or optical isolation. Isolation chips typically consist of two parts: isolation front-end and isolation back-end.

• Prospect sharing of silicon carbide (SiC) substrate sheets Silicon carbide (SiC) substrate is one of the key materials for manufacturing SiC devices, which can provide high lattice matching, low defect density, and high-quality surface flatness. With the continuous expansion of the silicon carbide power device market, silicon carbide substrate sheets have also been widely used and are expected to continue to maintain rapid growth in the coming years.

• Comparison of driving circuit differences between SiC MOSFET and Si IGBT SiC MOSFET and Si IGBT are both indispensable products for the development of electronic products. SiC MOSFET and Si IGBT have many common characteristics and differences. Therefore, the following is a comparison of their product differences:

• Introduction to Low Sensitivity SiC Power Modules Low inductance SiC power module refers to a power module that uses silicon carbide (SiC) as a semiconductor material and has a lower inductance value. Compared with traditional silicon (Si) power modules, low inductance SiC power modules have higher switching speed and lower switching losses, thereby improving the efficiency and reliability of the system.

• Design and Manufacturing Process of Silicon Carbide (SiC) MOSFET Chip For silicon carbide MOSFETs (SiC MOSFETs), high-quality substrates can be purchased externally, and high-quality epitaxial wafers can also be purchased externally. However, this only provides a good foundation for obtaining a silicon carbide device. High performance silicon carbide devices have extremely high requirements for device design and manufacturing processes. This article will introduce you to the design and manufacturing process of SiC MOSFET devices.

• Power module equipped with SiC MOSFET and SiC SBD Recommendation: Power modules equipped with SiC MOSFETs and SiC SBDs

• 5 important techniques for selecting gallium nitride (SiC) MOSFETs To prove that your choice of SiC as the preferred power semiconductor for switch mode design is correct, please consider the following prominent features. Compared to standard or super junction MOSFETs or even IGBTs, SiC devices can operate at higher voltages, frequencies, and temperatures. Most of the power loss of other devices does not exist in SiC devices, so the efficiency of SiC devices can reach over 90% in most applications. Initially, SiC devices were more expensive than other MOSFETs or IGBTs.

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