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ETC0420H1R0MTT,ELLON,Molded Power Inductors

ETC0420H1R0MTT

Molded Power Inductors ,0420 ,1.0uH ,±20% ,4.5A ,Chip SMD ,ELLON-ETC

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The image is for reference only, please refer to the drawing for details

Data Sheet： POWER INDUCTORS-ETC SERIES.pdf

Product number：	L03-0420-1R0M4A50SLC
Manufacturer Product Number：	ETC0420H1R0MTT
Manufacturer ：	ELLON
Series ：	ELLON-ETC
Type ：	Molded Power Inductors
Size ：	0420
Value ：	1uH
Tolerance ：	±20%
Termination Style ：	-
Rated Current ：	4.5A
Description：	Molded Power Inductors ,0420 ,1.0uH ,±20% ,4.5A ,Chip SMD ,ELLON-ETC

Series Introduce Find Similar

Attribute Name	Attribute Value
Manufacturer	ELLON
Product Series	ELLON-ETC
Product Type	Molded Power Inductors
EU RoHS	Compliant(2011/65/EU)
EU REACH	Dose not contain REACH SVHC(1907/2006/EC)

Series Introduce Find Similar

File

File Type	File Name
Data Sheet	POWER INDUCTORS-ETC SERIES.pdf

Lead time： Estimated delivery date when out of stock 2025-03-28

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20

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200

$0.106018

500

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1000

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MPQ：3000

MOQ： 3000

MOQ：20

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Product Recommendation Maker Dynamics Applications

Product Recommendation Maker Dynamics Applications

Do we need to lay copper foil underneath the inductor for DC-DC power supply? Inductors have alternating current, and laying copper at the bottom of the inductor will generate eddy currents on the ground plane. The eddy current effect will affect the inductance of the power inductor, and eddy currents will also increase system losses. At the same time, the noise generated by alternating current will increase the noise on the ground plane, which will affect the stability of other signals. From the perspective of EMC, laying copper on the bottom of the inductor and a complete ground surface is beneficial for EMI design; The current production process of inductors has been upgraded, and shielded inductors are used. There are very few leaked magnetic induction lines, which have little impact on the inductance of the inductors and are also beneficial for heat dissipation.

Product Recommendation Maker Dynamics Applications

Introduction to EAM series products of high power resistance with sulfide resistant metal film Ellon (Yineng) has launched a new series of high power surface mount resistors (EAM) with anti sulfurization metal film. This series belongs to ultra-high power metal film anti sulfurization resistors, which are widely used in industries such as network communication, optoelectronic modules, rectifiers, automotive electronics, home appliances, industrial automation, etc. The main volume of EAM anti sulfurization metal film high-power resistors includes: 040206030805120612102010 and 2512 full series volume, which can meet the requirements of anti sulfurization and high power, with low temperature coefficient and stable products.

ELLON launches 1206 volume 2W high-power alloy resistor - latest product ELLON launches 1206 volume 2W high-power alloy resistor. The resistance range of the 1206 high-power 2W alloy resistor launched this time is 0.001R (1m Ω)~0.025R (25m Ω), mainly made of MnCu alloy, FeCrAl alloy, and Kama alloy. The 1206 volume 2W alloy resistor can replace the traditional 2512 volume 2W alloy, and has the characteristics of small volume, high power, and low cost. In the future, it may be extended to a wider range of volumes and resistance values. This article provides a detailed introduction to the resistance parameters of ELLON's 1206 volume high-power 2W alloy.

ESR bare copper shunt resistor product with increased power and new product ESR bare copper shunt resistors are mainly characterized by low resistance, high power, and low temperature drift, and are widely used in current sampling circuits. In current sampling circuits, the stability requirements for resistors are extremely strict. Therefore, different product materials have different product characteristics and application markets. With the market demand for product miniaturization, low power consumption, and fast charging and discharging, ELLON has launched a small volume high-power bare copper shunt resistor. This article provides a detailed introduction to the corresponding specification parameters.

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