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ETC1050T470MTT,ELLON,Molded Power Inductors

ETC1050T470MTT

Molded Power Inductors ,1050 ,47uH ,±20% ,3.5A ,Chip SMD ,Carbonyl

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The image is for reference only, please refer to the drawing for details

Data Sheet： POWER _INDUCTORS_ETC.pdf

Product number：	L03-1050-470M3A50STLC
Manufacturer Product Number：	ETC1050T470MTT
Manufacturer ：	ELLON
Series ：	ELLON-ETC
Type ：	Molded Power Inductors
Size ：	1050
Value ：	47uH
Tolerance ：	±20%
Rated Current ：	3.5A
Description：	Molded Power Inductors ,1050 ,47uH ,±20% ,3.5A ,Chip SMD ,Carbonyl

Series Introduce Find Similar

Attribute Name	Attribute Value
Manufacturer	ELLON
Product Series	ELLON-ETC
Product Type	Molded Power Inductors
EU RoHS	Compliant(2011/65/EU)
EU REACH	Dose not contain REACH SVHC(1907/2006/EC)

Series Introduce Find Similar

File

File Type	File Name
Data Sheet	POWER _INDUCTORS_ETC.pdf

Lead time： Estimated delivery date when out of stock 2025-04-02

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Product Recommendation Maker Dynamics Applications

Product Recommendation Maker Dynamics Applications

Do we need to lay copper foil underneath the inductor for DC-DC power supply? Inductors have alternating current, and laying copper at the bottom of the inductor will generate eddy currents on the ground plane. The eddy current effect will affect the inductance of the power inductor, and eddy currents will also increase system losses. At the same time, the noise generated by alternating current will increase the noise on the ground plane, which will affect the stability of other signals. From the perspective of EMC, laying copper on the bottom of the inductor and a complete ground surface is beneficial for EMI design; The current production process of inductors has been upgraded, and shielded inductors are used. There are very few leaked magnetic induction lines, which have little impact on the inductance of the inductors and are also beneficial for heat dissipation.

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