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NLV32T-2R2J-PF,TDK,Power Inductors

NLV32T-2R2J-PF

Power Inductors ,1210(3.2*2.5mm) ,2.2uH ,±5% ,320mA ,- ,- ,Chip SMD

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The image is for reference only, please refer to the drawing for details

Data Sheet： TDK_NLV32-PF.pdf

Product number：	L12-1210-2R2JA320000SPF
Manufacturer Product Number：	NLV32T-2R2J-PF
Manufacturer ：	TDK
Series ：	TDK-NLV32-PF
Type ：	Power Inductors
Size ：	1210
Value ：	2.2uH
Tolerance ：	±5%
DC Resistance ：	320mA
Description：	Power Inductors ,1210(3.2*2.5mm) ,2.2uH ,±5% ,320mA ,- ,- ,Chip SMD

Series Introduce Find Similar

Attribute Name	Attribute Value
Manufacturer	TDK
Product Series	TDK-NLV32-PF
Product Type	Power Inductors
EU RoHS	Compliant(2011/65/EU)
EU REACH	Dose not contain REACH SVHC(1907/2006/EC)

Series Introduce Find Similar

File

File Type	File Name
Data Sheet	TDK_NLV32-PF.pdf

Lead time： Estimated delivery date 2026-10-12

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Product Recommendation Maker Dynamics Applications

Product Recommendation Maker Dynamics Applications

Do we need to lay copper foil underneath the inductor for DC-DC power supply? Inductors have alternating current, and laying copper at the bottom of the inductor will generate eddy currents on the ground plane. The eddy current effect will affect the inductance of the power inductor, and eddy currents will also increase system losses. At the same time, the noise generated by alternating current will increase the noise on the ground plane, which will affect the stability of other signals. From the perspective of EMC, laying copper on the bottom of the inductor and a complete ground surface is beneficial for EMI design; The current production process of inductors has been upgraded, and shielded inductors are used. There are very few leaked magnetic induction lines, which have little impact on the inductance of the inductors and are also beneficial for heat dissipation.

Product Recommendation Maker Dynamics Applications

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