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EHP25FS22R6EDS,ELLON,High Power Thick Film Chip Resistor

EHP25FS22R6EDS

High Power Thick Film Chip Resistor,2512 ,22.6R ,±1% ,2W ,- ,±100PPM

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The image is for reference only, please refer to the drawing for details

Data Sheet： EHP_High_power.pdf

RoHs Report： RoHS_20241015A.pdf

REACH Report： REACH_SZXEC24003220502.pdf

Product number：	R10-2512-22R6F1S001LEHP0
Manufacturer Product Number：	EHP25FS22R6EDS
Manufacturer ：	ELLON
Series ：	ELLON-EHP
Type ：	High Power Thick Film Chip Resistor
Size ：	2512
Resistance Value ：	22.6Ω(22.6R)
Resistance Tolerance ：	±1%
TCR(ppm) ：	±100PPM
Resistance Power ：	2W
Description：	High Power Thick Film Chip Resistor,2512 ,22.6R ,±1% ,2W ,- ,±100PPM

Series Introduce Find Similar

Attribute Name	Attribute Value
Manufacturer	ELLON
Product Series	ELLON-EHP
Product Type	High Power Thick Film Chip Resistor
EU RoHS	Compliant(2011/65/EU)
EU REACH	Dose not contain REACH SVHC(1907/2006/EC)

File

File Type	File Name
Data Sheet	EHP_High_power.pdf
RoHs Report	RoHS_20241015A.pdf
REACH Report	REACH_SZXEC24003220502.pdf

Lead time： Estimated delivery date 2025-05-27

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Product Recommendation Maker Dynamics Applications

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Do we need to lay copper foil underneath the inductor for DC-DC power supply? Inductors have alternating current, and laying copper at the bottom of the inductor will generate eddy currents on the ground plane. The eddy current effect will affect the inductance of the power inductor, and eddy currents will also increase system losses. At the same time, the noise generated by alternating current will increase the noise on the ground plane, which will affect the stability of other signals. From the perspective of EMC, laying copper on the bottom of the inductor and a complete ground surface is beneficial for EMI design; The current production process of inductors has been upgraded, and shielded inductors are used. There are very few leaked magnetic induction lines, which have little impact on the inductance of the inductors and are also beneficial for heat dissipation.

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Product Recommendation Maker Dynamics Applications

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