HNST WELCOME！ 0755-23173910
English  |中文
{{searchSelectTypeText}} Search
walter SMD fuse Precision resistor fuse current diverter ever ohms Alloy resistance
Total amount：{{isChinese?'￥':'$'}}{{cartProductTotal}}
Cart {{cartCount}}
CATEGORY

{{isChinese?level2CategoryView.viewNameCn:level2CategoryView.viewNameEn}}

你当前的浏览器版本过低或不支持。请升级或更换浏览器。推荐浏览器 Chrome Edge。
HNST → AMS OSRAM

Hot Product

Surface Mount Fuses 1206HC30A48V
Surface Mount Fuses 1206T3.5A63V
Glass Tube Fuses TAP-T3A15V2T02300BG
Metal Current Sensing Chip Resistor STEJ0603
Metal Current Sensing Chip Resistor STE2512M2W0R300F

Hot Article

TDK Brand Introduction Founded in 1935 and headquartered in Tokyo, Japan, TDK Corporation is a leading global manufacturer of electronic components and materials. Its name originates from the original Japanese name "Tokyo Denki Kagaku Kogyo K.K." and was renamed TDK Corporation in 2008. The company started with magnetic material technology and gradually expanded into diversified fields such as electronic components, sensors, and energy equipment, with business coverage worldwide.
Classification of Memory Brands and Representative Enterprises Memory, as the core component of data storage, covers multiple fields such as memory modules, solid-state drives (SSDs), mechanical hard drives (HDDs), flash memory products (such as USB drives, storage cards), etc. The following are mainstream brand classifications and representative enterprises based on comprehensive market performance and technological strength:
What are the internationally renowned brands of memory? Memory, as the core branch of the semiconductor industry, exhibits a highly concentrated and segmented international brand pattern. From the three dimensions of technology roadmap, market level, and application field, combined with the latest industry trends in 2025, systematically sort out the mainstream global memory brands:
Difference between MLCC multilayer Ceramic capacitor COG and X7R MLCC is the abbreviation of multilayer Ceramic capacitor, which is a common chip capacitor. When choosing MLCC, you often encounter different material choices, such as COG and X7R. The following will provide a detailed introduction to the differences between COG and X7R materials. COG and X7R are two common MLCC materials that have significant differences in temperature coefficient, frequency characteristics, capacity size, and price. When choosing MLCC, it is necessary to choose the appropriate material based on the specific application requirements.
How much A current and how much V voltage do fast charging data cables generally have to withstand? The fast charging data cable needs to be selected according to the protocol supported by the device, commonly consisting of 3A-5A current+5V-20V voltage. High power scenarios (such as 100W+) require dedicated cables. Pay attention to the three core elements of AWG wire diameter, E-Marker chip, and protocol compatibility when purchasing.