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Sony and Samsung have continuously expanded their market share through the launch of new products, while Chinese manufacturers Huawei and SITTV have achieved breakthroughs in 50 million pixel main camera image sensors. We believe that the cost-effectiveness of domestically produced 50 million pixel sensors will also drive the recovery of the smartphone market. We will wait and see what new breakthroughs will be achieved in the future image sensor technology under the pressure of mobile terminal demand.
Comparing the progress and issues of TSMC's Japanese and TSMC's American factories, TSMC's future progress in European factories is not only limited to subsidies. As mentioned earlier, the harsh working environment and overloaded working hours of wafer fabs are believed to be the main reasons for trapping European factories. Of course, the shortage of talent is also another factor that cannot be ignored.
Less than 5 years after listing in China, with a market value exceeding 30 billion yuan, Zuojiang Technology, once known as a "chip giant" and "competitor of NVIDIA," announced its delisting, and its stock price fell from 299.98 yuan to 6.94 yuan.
On June 30th, Ian Buck, Vice President and General Manager of NVIDIA's Large Scale and HPC Business, recently stated at the 2024 Global Technology Conference of Bank of America Securities that customers are investing billions of dollars to purchase new NVIDIA hardware to keep up with the demand for updated AI models, thereby increasing revenue and productivity.
The second quarter is coming to an end, and the market is still in a strong wait-and-see atmosphere, with intense competition for large orders. Part of the original brands in the spot market are accelerating the shipment of finished products, and the competition among channels for orders remains fierce; Although there has been an increase in terminal inquiry behavior in the industry market, the overall transaction willingness is not strong. In addition, due to sluggish market demand, there have been signs of price loosening in some large capacity embedded systems recently.
The two biggest cost drivers in cold plate manufacturing are thermal conductivity requirements and annual demand, which are usually little or no control by thermal engineers and manufacturing engineers. However, you can reduce costs by understanding how roughness, flatness, hardness, surface morphology, installation characteristics, and liquid connection specifications affect the cost of cold plates. By involving cold plate manufacturers in the early stages of the design process, you will be able to identify manufacturing cost drivers and select the most cost-effective design.
The test results show that at the maximum design heat output of 6 kW, the system can quickly respond to thermal management requirements in about 150 seconds and has fast temperature response characteristics; The average surface temperature of the battery cold plate can be controlled within the optimal temperature range of 15-20 ℃, achieving good temperature uniformity with a temperature difference of less than 4 ℃, and the system COP is stable above 2.8.
Abstract: This article provides an overview of the thermal characteristics and design of IGBT modules, introduces the thermal impedance network model of IGBT modules, and its relationship with the thermal performance and size of packaging materials; Discuss the key points of thermal design for modules from the aspects of chip and module packaging materials, structure, etc., and explain the thermal design of traditional IGBT modules and new crimping IGBT modules.
The innovative application of FPGA demonstrated by Lattice Semiconductor has brought revolutionary technological progress to multiple industries. By continuously expanding its product line and technological applications, Lattice has not only improved the performance and functionality of FPGA, but also promoted rapid development in fields such as embedded vision, artificial intelligence, security, and industrial automation.
Xinqiyuan was founded by Lu Sheng, who graduated with a bachelor's and master's degree from Shanghai Jiao Tong University and Lamar University in the United States. He has been engaged in chip research and development in Silicon Valley for more than 20 years, witnessing and participating in the Golden Decade of Silicon Valley chips (1994-2004). He has served as a senior executive of international chip giants such as Broadcom and Marvell, and participated in mergers and acquisitions of multiple innovative enterprises and projects, leading the giant companies to achieve multiple successful cases.
