As the "bridge" of electronic systems, interface chips (ICs) can be divided into six core categories, each with unique functions and application scenarios:
Communication protocol interface chip
The communication protocol interface chip IC undertakes the task of data exchange between devices, and the mainstream types include:
USB series chips (supporting USB 2.0/3.0/4.0 protocols)
Ethernet controller (compatible with 10/100/1000Mbps)
PCIe interface chip (supporting high-speed peripheral interconnect)
Thunderbolt controller (achieving 40Gbps ultra high speed transmission)
Display driver interface chip
The video transmission dedicated interface IC includes:
HDMI 2.1 Controller (Supports) 8K@60Hz ）
DisplayPort 1.4 chip (HDR content transmission)
LVDS driver chip (industrial screen display solution)
MIPI Interface Processor (Mobile Device Display Core)
Industrial control interface chip
The dedicated interface IC for harsh environments includes:
CAN bus transceiver (automotive electronic core)
RS485/422 interface chip (industrial automation)
PROFIBUS protocol chip (in the field of process control)
Modbus Conversion IC (Industrial Internet of Things Node)
Storage Expansion Interface Chip
Data storage dedicated interface solution:
SATA III control chip (6Gbps transmission)
NVMe Protocol Processor (PCIe Channel Acceleration)
SD/eMMC Controller (Mobile Storage Management)
UFS interface chip (high-speed storage for smart devices)
Wireless Internet Interface Chip
The RF interface IC includes:
WiFi 6/6E baseband chip
Bluetooth 5.3 dual-mode processor
Zigbee 3.0 protocol stack chip
NFC Controller (Near Field Communication)
Signal conditioning interface chip
Key components for basic signal processing:
Level conversion chip (3.3V/5V system interconnection)
ESD protection devices (interface circuit protection)
Differential signal driver (long-distance transmission)
Optocoupler isolation chip (electrical isolation guarantee)
The technological evolution of interface chip ICs presents three major trends: the development of transmission rates towards 56Gbps+, the continuous enhancement of protocol compatibility, and the increasing intelligence of power management. When selecting, key parameters such as protocol standards, transmission bandwidth, power supply architecture, and environmental adaptability should be considered to ensure system level optimization design.
