The main six specific processes of SiC chip manufacturing
SiC chip manufacturing typically involves the following six steps:
1. Preprocessing: The main focus here is on the preparation of the chip surface, which requires processes such as grinding, polishing, or jetting to ensure its flatness and smoothness, as well as to remove impurities and impurities.
2. Wafer processing: The main focus here is on the processing of the wafer surface, which can change the surface structure of the wafer through etching or deposition methods, improve the adsorbability and corrosion resistance of the wafer, etc.
3. Crystal growth: This mainly involves the processing of crystal fluids, which can be formed on the wafer surface through methods such as distillation, physical vapor deposition (PVD), or chemical vapor deposition (CVD) to form a coating layer with high surface depth and integrity.
4. The design and production of integrated circuits: This mainly involves generating different types of integrated circuits through computer design programs to design chips with good performance, and using the form on the wafer to produce integrated circuits with specific functions.
5. Chip testing: After the completion of chip fabrication, testing is also required to ensure the completeness and reliability of integrated circuit functionality and performance.
6. Integration: The final step is to integrate the chip onto the chip to ensure the quality and reliability of the final product