The SiC module loss reduction plan mainly considers the following four aspects:
1. Adopting low voltage and low frequency design: The performance of SiC modules is mainly affected by voltage and frequency. When the voltage and frequency are lower, the losses will be correspondingly reduced.
2. Optimize the driver program: The performance of SiC modules is affected by voltage, frequency, and driver program design, so it is important to focus on optimizing the driver program to minimize losses.
3. Optimize structural design: Reasonable structural design should be adopted to reduce the encapsulation of heat sinks outside the circuit, in order to minimize the propagation of heat, facilitate module cooling, and reduce losses.
4. Adopting low side resonance technology: Low side resonance technology can effectively reduce differential losses caused by frequency and voltage changes, thereby helping to reduce module losses.
