HNST WELCOME！ 0755-23173910

English |中文

{{searchSelectTypeText}}

Search

ever ohms Alloy resistance current diverter Precision resistor fuse SMD fuse walter

Cart {{cartCount}}

你当前的浏览器版本过低或不支持。请升级或更换浏览器。推荐浏览器 Chrome Edge。

JX7S0750R170T3,JX,MOSFETS

JX7S0750R170T3

MOS ,JX7S0750R170T3 ,N-ch ,60W ,5A ,1700V ,TO-263-7

✖

The image is for reference only, please refer to the drawing for details

Company Profile：公司简介.pdf

Data Sheet： JX7S0750R170T3.pdf

Product number：	MOS-MM141N0W60M1017223JX
Manufacturer Product Number：	JX7S0750R170T3
Manufacturer ：	JX
Series ：	JX-MOS
Product Type ：	MOSFETS
Configuration ：	N-ch
Power Dissipation (PD) ：	60W
Continuous Drain Current (ID) ：	5A
Drain-Source Voltage (V) ：	1700V
Package ：	TO263-7
Description：	MOS ,JX7S0750R170T3 ,N-ch ,60W ,5A ,1700V ,TO-263-7

Series Introduce Find Similar

Attribute Name	Attribute Value
Manufacturer	JX
Product Series	JX-MOS
Product Type	MOSFETS
EU RoHS	Compliant(2011/65/EU)
EU REACH	Dose not contain REACH SVHC(1907/2006/EC)

Series Introduce Find Similar

File

File Type	File Name
Company Profile	公司简介.pdf
Data Sheet	JX7S0750R170T3.pdf

Lead time： Estimated delivery date 2026-04-19

Quantity

Unit Price

1

$4.340769

10

$3.544962

50

$2.893846

Quantity

Unit Price

200

$2.532116

1000

$2.098039

* Order quantity ：

MPQ：1800

MOQ： 1800

MOQ：1

When the purchase quantity is less than the inventory, you can purchase directly, the purchase quantity is: N * MOQ
When the purchase quantity is greater than the inventory, you need to order; when ordering, the purchase quantity is: N * MPQ

Order quantity

Unit Price

Count

{{product.num}}

{{ isCn?'￥':'$'}}{{ isCn?product.price:product.usdPrice}}

{{isCn?'￥':'$'}}{{ isCn?product.subTotal:product.usdSubTotal}}

{{isCn?'￥':'$'}}{{ isCn?product.subTotal:product.usdSubTotal}}

Lead time： {{ (product.stock > 0 && product.num <= product.stock) ? 'In stock': 'Estimated delivery date ' + product.leadDate }}

Add to cart Buy it now

Product Recommendation Maker Dynamics Applications

Product Recommendation Maker Dynamics Applications

What is MOS transistor? MOS transistor is an abbreviation for MOSFET. Introduction to MOS transistor The full English name of MOSFET is MOSFET (Metal Oxide Semiconductor Field Effect Transistor), which refers to the insulated gate type of MOSFET. Therefore, MOS transistors are sometimes referred to as insulated gate field-effect transistors. In general electronic circuits, MOS transistors are commonly used in amplifier circuits or switch circuits.

Why does high negative pressure in SiC MOS affect threshold drift The threshold drift of SiC MOSFET is affected by negative pressure because this device has a high leakage current, which reduces the difference between the control terminal voltage and the source terminal voltage, thereby affecting the switching performance of MOSFET. In addition, high negative pressure may also cause MOSFETs to enter rupture mode and trigger other adverse effects.

Silicon carbide (SiC) power devices need to be used in conjunction with pull-down resistors Silicon carbide (SiC) pull-down resistor usually refers to the resistor used in SiC power devices to control the closing speed of the device. In SiC power devices, due to their high-speed switching characteristics and high peak voltage, high peak currents are generated when the control device is turned off, which can cause equipment failure or electromagnetic interference. Therefore, in SiC power devices, it is necessary to reduce the peak current during the shutdown process by using pull-down resistors to protect the equipment and reduce electromagnetic interference.

The working environment and application market of SiGaNSiC MOSFETs and Si IGBTs Compared with MOSFET, SiC perfectly solves the problem of difficult simultaneous implementation of high voltage and high frequency in silicon-based materials. Based on compatibility with high voltage and medium frequency, SiC MOSFET has become the optimal solution for electric vehicles, charging stations, and photovoltaic inverters (without considering cost) due to its high efficiency and small size;

Analysis of Silicon Carbide (SiC) Technology Barriers: What are the Silicon Carbide Technology Barriers Groove type silicon carbide power devices have greater manufacturing difficulty. According to the different device structures, silicon carbide power devices can be mainly divided into planar devices and trench devices. Flat silicon carbide power devices have good unit consistency, simple manufacturing process, but are prone to JFET effect and have high parasitic capacitance and on state resistance. Compared to planar devices, groove type silicon carbide power devices have lower unit consistency and more complex manufacturing processes. However, the groove structure is beneficial for increasing device unit density, reducing the occurrence of JFET effect, and solving the problem of low channel mobility. It has excellent performance such as low on resistance, low parasitic capacitance, and low switching energy consumption, and has significant cost and performance advantages. It has become the mainstream direction of silicon carbide power device development.

Characteristics and Application Scenarios of Silicon Carbide (SiC) SiC Ceramic is a high-performance material with characteristics such as high strength, high hardness, high temperature stability, excellent corrosion resistance, and low thermal expansion coefficient. It is widely used in fields such as semiconductor, aviation, defense, nuclear energy, and chemical industry.

SiC MOS driver design SiC MOS driver design is a complex process that requires consideration of many factors, such as electrical performance, thermal characteristics, and packaging selection. To improve reliability and performance, the following aspects should be considered:

Wide application of silicon carbide (SiC) MOSFET in new energy charging piles Silicon carbide power devices cover series such as 650V/2A-100A, 1200V/2A-90A, 1700V/5A-80A, etc. The products have been put into mass production and can fully benchmark the advanced quality and level of international brand peers. We have successively launched full current voltage level silicon carbide Schottky diodes and silicon carbide MOSFET series products that have passed industrial and automotive reliability tests, with performance reaching the international advanced level. They are applied in fields such as solar inverters, new energy electric vehicles and charging piles, smart grids, high-frequency welding, rail transportation, industrial control special power supplies, and national defense and military industries.

The main six stages of SiC chip manufacturing The main six specific processes of SiC chip manufacturing are pre-processing, wafer processing, crystal growth, integrated circuit design and fabrication, chip testing, and integration.

MOS transistor as a special driving circuit for switch transistor applications (commutation circuit) MOS transistor is a special driving circuit (commutation circuit) used as a switching transistor. Compared with ordinary transistor, MOS transistor has many advantages. However, when applied as a high-power switch transistor, due to the capacitive input characteristics of MOS transistor, the input terminal of MOS transistor is equivalent to a small capacitor. The input switch excitation signal is actually in the process of repeatedly charging and discharging this capacitor. During the charging and discharging process, the MOS transistor conducts and closes with a lag, which slows down the process of "on" and "off", which is not allowed by the switching element (increased power consumption, burning out the switch transistor).

Product Recommendation Maker Dynamics Applications

Product number： {{currentProduct.code}}

Product information： {{currentProduct.descCn}}

Order quantity： {{currentProduct.num}}

Cart （{{myCartItems.length}}Item）

Total amount：

{{isCn?'￥':'$'}}{{cartProductTotal}}