Murata Manufacturing Co., Ltd. is collaborating with Infineon Technologies AG (headquartered in Germany, hereinafter referred to as "Infineon Company") to provide a new platform solution for STM32 MCU for IoT device developers.
This solution is powered by Infineon's Wi Fi ™/ The Murata communication module of Bluetooth ® integrated chip, combined with Infineon AIROC provided by Infineon ™ Composed of STM32 Expansion Pack and combined with STM32 Nucleo board-144, developers can easily use Murata's communication module for product development.
This solution can meet a wide range of product development requirements, such as low power consumption projects for wearable devices and battery driven IoT devices, as well as high-performance projects for industrial devices, providing IoT device developers with a simpler and more efficient wireless connectivity product development environment. The implementation of this solution relies on Infineon's long-term business partnership with Murata.
The characteristics of this solution
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Equipped with Murata Wi Fi through connection ™/ The M.2 board of Bluetooth ® combination module and the adapter board using Nucleo board - M.2 STMicroelectronics company's STM32 Nucleo board-144 allows for simple hardware environment setup;
Supports multiple Wi Fi options ™/ Bluetooth ® Combo Module, including Wi Fi 4 Wi Fi 5 is compatible with Industrial grade modules and can be selected from a wide range of product lineups based on its purpose and application;
Supports multiple STM32 Nucleo boards with low power consumption and high performance (STM32H5, U5 series, etc;
By using Infineon AIROC provided by Infineon ™ STM32 Expansion Pack, Developers can start developing more easily and effectively.
Neil Chen, Director of Wi Fi Product Line Marketing at Infineon, commented: "In order to lower the entry threshold for the initial development of IoT devices, semiconductor manufacturers and module manufacturers need to collaborate with each other to provide simple, easy-to-use, and easy to productize solutions for the market. This time, through business cooperation with Murata, industry-leading AIROC will be applied." ™ And Bluetooth ® "Product portfolio makes the development of next-generation IoT products for multiple applications easier and more feasible."
"We are pleased to collaborate with Infineon, a globally renowned enterprise in the field of IoT semiconductors, to provide this solution. Our clients face various problems before launching their interconnect products into the market. This business collaboration has solved various issues before evaluating, and is a solution that can shorten the launch cycle of application products in various fields."